Template:Asic/sandbox

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ASICMiner


ASICMiner
Facilitators: BitQuan,BitFountain
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BE100 BCT
Introduced: 2012-Dec-28
Technical specifications
Package: Sawn QFN40 6x6mm
Markings: BE100
Die:4.66x4.66mm@130nm
Gh/sJ/GhMh/JVMHzWh/HzGh/mm²η-factor
0.33661671.053362.01610.024249.2
0.39281251.153923.13610.024957.4
Notes: The letters 'BE' in the component name/markings stands for "Block Erupter". ASICMiner considers the BE100 their 'Gen1' product.
Used on: Block Erupter USB, Block Erupter Cube, Block Erupter Blade
ASICMiner unknown BCT
Facilitators: BitQuan,BitFountain
Planned: 2012-Nov
No pictures available
Die:65nm
Canceled (see notes for details)
Notes: This chip would formally have been ASICMiner's 'Gen2' product.
Development appears to have been canceled prior to production.

ASICMiner
Facilitators: BitQuan,BitFountain
Top (8x8mm)
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BE200www BCT
Introduced: 2014-Mar-28
Datasheet: package dimensions,pins/protocol, pinout
Technical specifications
Package: Sawn QFN64 8x8mm
Markings: BE200 / [lot]
Known codes: lot:8P01N,9C01H,9P02A,9P02H
Die:40nm
Gh/sJ/GhMh/JVMHzWh/HzGh/mm²η-factor
9.60.6615150.86.336
Notes: ASICMiner considers this their 'Gen3' product. Was made available in 8x8mm and 9x9mm packages.
Used on: ASICMiner Tube, ASICMiner Prisma

ASICMiner
Facilitators: BitQuan,BitFountain
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Layout
Layout
BE300S prototype BCT
Introduced: 2014-Sep-16
Technical specifications
Package: Sawn QFN40*
Markings: BE300S
Die:28nm
Foundry: TSMC
Gh/sJ/GhMh/JVMHzWh/HzGh/mm²η-factor
30.18753420.5616
5.20.24740501.28388
Notes: This was a prototype manufactured on an MPW. The package appears to be soldered on only 2 sides, which may imply that internally there are also only bond wires to those two sides.
ASICMiner BE300(S) BCT
Facilitators: BitQuan,BitFountain
Planned: 2015-Feb
No pictures available
Package: FCLGA 5x5mm Die:28nm Foundry: TSMC
May not actually exist (see notes for details)Mining: 8Gh/s 0.038J/Gh, 12Gh/s 0.038J/Gh, 6Gh/s 0.033J/Gh, 9Gh/s 0.022J/Gh
Notes: ASICMiner would consider this their 'Gen4' product. The expected hashing performance and package size is preliminary.
The BE300(S) is understood not to be in production at this time.
ASICMiner Unknown
Facilitators: BitQuan,BitFountain
Planned: 2015
No pictures available
Die:16nm
Future (see notes for details)
Notes: The planned node size would be 16nm or 14nm
This chip is planned to be introduced in the future.

Avalon Project


Avalon Project
Facilitators: Canaan Creative, BitSynCom
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Layout
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Die (power)
Die (power)
Die (cores)
Die (cores)
A3256www BCT
Introduced: 2013-Jan-20
Datasheet: datasheet, package
Technical specifications
Package: Sawn QFN48 7x7mm
Markings: Old Avalon logo / A3256-Q48 / [lot/date]
Known codes: P6M56213042C,P6M56313052C,PP787813212
Die:3.976x4.056mm@110nm
Foundry: TSMC
Gh/sJ/GhMh/JVMHzWh/HzGh/mm²η-factor
0.2956.61521.153751.9470.790.023043.45
Notes: First ASIC to be put to market, with first delivery of a miner to Jeff Garzik.

Avalon Project
Facilitators: Canaan Creative, BitSynCom
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A3255www BCT
Introduced: 2013-Aug
Datasheet: datasheet, package
Technical specifications
Package: Sawn QFN48 7x7mm
Markings: Avalon logo / A3255-Q48 / [lot/date]
Known codes: SKWL0613452CMU
Die:55nm
Foundry: TSMC
Gh/sJ/GhMh/JVMHzWh/HzGh/mm²η-factor
1.51.66250.87502.42
1.52.454081.07503.6752

Avalon Project
Facilitators: Canaan Creative, BitSynCom
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A3233www
Introduced: 2014-Apr
Datasheet: datasheet, package
Technical specifications
Package: Sawn QFN48 7x7mm
Markings: Avalon logo / A3233-Q48 / [lot/date]
Known codes: P6P73914092CMU,P6P73914102CAL
Die:40nm
Foundry: TSMC
Gh/sJ/GhMh/JVMHzWh/HzGh/mm²η-factor
7.080.7513330.556005.3111.8
7.080.8911240.896006.301211.8

Avalon Project
Facilitators: Canaan Creative, Alchip Technologies, Ltd
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A3222www BCT
Introduced: 2014-Sep
Datasheet: datasheet, package
Technical specifications
Package: Sawn QFN56 8x8mm
Markings: Avalon logo / A3222-Q56 / [lot/date]
Known codes: T8A98911434EMAA,T4V9181435ECLA
Die:28nm
Foundry: TSMC
Gh/sJ/GhMh/JVMHzWh/HzGh/mm²η-factor
250.425000.654001062.5
250.616670.84001562.5

BitFury Group


BitFury Group
Facilitators: IMEC,Europractice,BioInfoBank Institute
Tops/Bottom
Tops/Bottom
Layout
Layout
Layout
Layout
Die (optical)
Die (optical)
Die (power)
Die (power)
Die (cores)
Die (cores)
BF756C55www BCT
Introduced: 2013-Jun-14
Datasheet: datasheet package pinout compilation
Technical specifications
Package: Sawn/Punched QFN48 7x7mm
Markings: β: β / 5Ghash / [date] / [lot] / TT
BioInfoBank: BioInfoBank logo / BIB756C55NM-BF / [date] / [lot]
CCCP: CCCP logo / CCCP756C55NM-BF / [date] / [lot]
Known codes: β: KRT8G, BioInfoBank: 1336/KYG0H, 1404/KCKCL, CCCP: 1340/KYW3Q
Die:3.8x3.8mm@55nm(full custom+global place&route)
Foundry: UMC
Gh/sJ/GhMh/JVMHzWh/HzGh/mm²η-factor
5.430.3826320.6874672.063411.630.387820.43
4.770.3528570.654101.669511.630.336869.88
3.260.2540000.5452800.81511.640.234695.14
2.50.2147620.52160.52511.570.173600.57
Notes: BitFury Group considers this their Gen 1, Rev 1 product.
It was originally designed at 65nm but die-shrunk down to 55nm[1].
It was widely released in at least 3 different packages/markings: The 'beta' / 5Ghash (estimated hash rate before practical tests) markings on a sawn package, BioInfoBank and CCCP markings on a punched package.
BitcoinTalk user vs3 holds a large collection of technical information about this chip in his NanoFury repository[2]

BitFury Group
Facilitators: IMEC,Europractice
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BF864C55www BCT
Introduced: 2014-Mar-03
Technical specifications
Package: Punched QFN48 7x7mm
Markings: BitFury Logo / BF864C55 / [lot]
Known codes: KCYLT,KCTMS
Die:55nm(full custom)
Foundry: UMC
Gh/sJ/GhMh/JVMHzWh/HzGh/mm²η-factor
3.8
0.52000
0.5
1.2
Notes: BitFury Group considers this their Gen 1, Rev 2 product.
This chip is pin- and protocol-compatible with the BF756C55, allowing many existing designs based on the BF756C55 to be upgraded.[3][4]
BitFury Group Unknown BCT
Introduced: 2015-Feb-28
No pictures available
Die:28nm (full custom)
Needs more information (see notes for details)Mining: 0.2J/Gh
Notes: BitFury Group considers this their Gen 4 product.[5]. No information is available on what their 'Gen 3' product may have been, or whether the earlier 'Gen 1 Rev 2' is to be seen as 'Gen 2'.
BitFury Group have stated that they will not be making chip samples or details available.[6]
As this chip is claimed to exist by a reputable party (BitFury Group), the information in this template requires expansion.
BitFury Group Unknown
No introduction date known
No pictures available
Die:16nm (full custom)
Future (see notes for details)Mining: 0.06J/Gh
Notes: BitFury Group considers this their Gen 5 product.
This chip is planned for the future and specifications are highly subject to change.

Bitmain Technologies Ltd.


Bitmain Technologies Ltd.
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BM1380www BCT
Introduced: 2013-Nov-11
Datasheet: datasheet
Technical specifications
Package: Sawn QFN56 8x8mm
Markings: Blank: n/a Common: Antminer logo / BM1380 / [lot/date]
Known codes: U02014G7
Die:3.464x3.464mm@55nm
Gh/sJ/GhMh/JVMHzWh/HzGh/mm²η-factor
1.60.66715000.751961.0678.160.132773.08
20.84711810.851.6940.173466.35
2.51.1288861.002.8210.214332.94
2.81.327581.103253.6958.620.234852.89
Notes: Bitmain considers this their 'Gen 1' product.

Bitmain Technologies Ltd.
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Bottom (mockup)
BM1382www BCT
Introduced: 2014-Apr
Datasheet: datasheet
Technical specifications
Package: Sawn FCQFN56* 8x8mm
Markings: Antminer logo / BM1382 / [lot/date]
Known codes: A100114w1
Die:28nm
Gh/sJ/GhMh/JVMHzWh/HzGh/mm²η-factor
14.180.52818930.722257.4963.02
17.330.70214250.8027512.1663.02
6.310063
25.240063
Notes: Bitmain considers this their 'Gen 2' product.
This chip uses a custom physical pin configuration that should be treated as a QFN with multiple exposed pads.

Bitmain Technologies Ltd.
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Bottom (mockup)
Bottom (mockup)
BM1384www BCT
Introduced: 2014-Sep
Datasheet: datasheet
Technical specifications
Package: Sawn FCQFN32* 8x8mm
Markings: Antminer logo / BM1384 / [lot/date]
Known codes: A10014o1
Die:28nm
Gh/sJ/GhMh/JVMHzWh/HzGh/mm²η-factor
8.250.24940090.601502.05855
15.1250.35428230.722755.35755
220.44822340.804009.84855
Notes: Bitmain considers this their 'Gen 3' product.
This chip uses a custom physical pin configuration that should be treated as a QFN with multiple exposed pads.

Black Arrow


Black Arrow Ltd
Facilitators: Verisilicon
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Bottom (mockup)
Bottom (mockup)
Layout
Layout
Minionwww [bct BCT]
Introduced: 2014-Apr-10
Datasheet: datasheet footprint
Technical specifications
Package: MCM UFCBGA900 25x25mm
Markings: Black Arrow logo / Black Arrow LTD / MINION / 99s256 / [date] / [lot]
Known codes: 1418 UXYL09065.000
Die:28nm
Foundry: Global Foundries
Gh/sJ/GhMh/JVMHzWh/HzGh/mm²η-factor
990.85100099
118.80.85120099
500.5200025
1.01
Notes: string
Black Arrow Ltd Unknown
Planned: 2015-May
No pictures available
Die:14nm Foundry: Global Foundries
Future (see notes for details)Mining: 0.3J/Gh
Notes: Tape-out was purportedly in December 2014[7]
This chip is slated for the future.

Butterfly Labs, Inc.


Butterfly Labs, Inc.
Facilitators: Chronicle Tech (now Custom Silicon Solutions)
Tops/Bottom
Tops/Bottom
Layout
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Die
Die
Die (detail)
Die (detail)
BitForce SCwww BCT
Introduced: 2013-Feb-08
Datasheet: datasheet(alt) protocol(alt)
Technical specifications
Package: FCBGA144 10x10mm
Markings: Blank:n/a ButterFly Labs Logo / BUTTERFLYLABS / BFSC100F144 / US10 / [lot] [date]
Known codes: 6770 3013,1393 3513
Die:7.5x7.5mm@65nm(full custom)
Foundry: Global Foundries/IBM
Gh/sJ/GhMh/JVMHzWh/HzGh/mm²η-factor
4.22.857350120.072563.17
43.23131.025012.8160.072441.11
Notes: ASIC based on their FPGA design. The first publicly known to exist Bitcoin ASIC.

Butterfly Labs, Inc.
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Monarch BCT
Introduced: 2014-Aug-21
Technical specifications
Package: FClBGA1020 23x23mm
Markings: Butterfly Labs logo / BFSC28NM02 2006 / FPBGA1188 [date] / [lot?]
Known codes: 2614
Die:28nm
Foundry: Global Foundries
Gh/sJ/GhMh/JVMHzWh/HzGh/mm²η-factor
4000.273704108
6000.392564234
10000.551818550
16000.7613161216
Notes: Package size is an estimate.

CoinTerra, Inc.


CoinTerra, Inc.
Facilitators: Open-Silicon
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Layout (1 die)
Layout (1 die)
GoldStrike 1www BCT
Introduced: 2013-Nov-08
Datasheet: infosheet, presentation presentation video
Technical specifications
Package: QMCM FCBGA1296 37.5x37.5mm
Markings: Q1 only: COINTERRA / GoldStrike 1 / [lot] / [date] TAIWAN
Q1-4: COINTERRA / GoldStrike 1 / [lot] / [date] TAIWAN
Known codes: Q1:UOLK46001B10 1352, Q1-4: UOLL04004.01A 1403, UOLK46006.01A 1403
Die:20x10mm@28nm
Foundry: Global Foundries Dresden
Gh/sJ/GhMh/JVMHzWh/HzGh/mm²η-factor
50434230.714001723683602.526914.88
72020003603.69878.4
Notes: Although the MCM package shows 4 dies, various documentation suggests only 3 are active silicon. Die size is thus an estimate based on 2*10x10mm
CoinTerra, Inc. SHIVAwww BCT
Facilitators: Global Unichip Corp
Planned: 2014-Sep-18
No pictures available
Die:16nm
Canceled (see notes for details)Mining: 0.225J/Gh
Assumed not to have gone into production before CoinTerra's Chapter 7 Bankruptcy.

Gridseed


Gridseed
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GC3355www BCT
Introduced: 2013-Dec
Datasheet: datasheet, I/O appnote register settings
Technical specifications
Package: Sawn QFN64 8x8mm
Markings: Gridseed logo / BTC & LTC / GC3355-Q64 / [lot/date]
Known codes: P6P19013462C
Die:40nm
Foundry: TSMC
Gh/sJ/GhMh/JVMHzWh/HzGh/mm²η-factor
12.354261.04002.352.5
1.52.3274301.06003.492.5
1.8752.3474261.07504.42.5
2.252.3564251.09005.32.5
Notes: This chip can perform SHA256(d) and Scrypt calculations. The performance figures are strictly for the SHA256(d) portion.
The 'GC' in the product code stands for 'GridChip'[8]

HashFast Technologies, LLC


HashFast Technologies, LLC
Facilitators: Uniquify,Ciara
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Die (1/4)
Die (1/4)
Layout
Layout
Golden Noncewww BCT
Introduced: 2013-Dec-19
Datasheet: datasheet protocol
Technical specifications
Package: QMCM FCBGA1936 43x43mm
Markings: Blank: n/a Q1 HashFast logo / GN-A0-CBH / [lot] / [date] KOREA
Known codes: T6A377.L0 4813, T6A385.00 0314, T6A416.00 1014
Die:18x18mm@28nm
Foundry: TSMC
Gh/sJ/GhMh/JVMHzWh/HzGh/mm²η-factor
422.40.6515380.81550274.567681.33577.36
537.67007681.664553.01
76810007682.376504.3
Notes: 'Golden Nonce' is a term used in Bitcoin mining, see: Golden Nonce
The MCM has four dies with active silicon, and each die is 9x9mm[9], giving an 18x18mm total die size.

iCoinTech

Innosilicon

KnCMiner Sweden AB

Spondoolies-Tech LTD

References